- Abpac Inc. [IA][Direct] -
IC packaging foundry providing quick turn and low-medium volume Ball Grid Array (BGA) packaging.
- BT Resin [IA][Direct] -
Materials for semiconductor plastics, packages & mcm-l.
- Cofer Corporation [IA][Direct] -
Providing back-end services for the semiconductor industry. Offering tape and reel, lead and mark inspection, lead conditioning, and many other services.
- Coors Electronic Package Company [IA][Direct] -
Supplier of ceramic packages for many diverse semiconductor and other electronic applications.
- Cree Research [IA][Direct] -
Supplies the majority of all silicon carbide (SiC) wafers and SiC-based semiconductor products in the world today.
- Dupont MicroCircuit Materials [IA][Direct] -
Supplier to the hybrid microcircuit and specialty thick film markets.
- Gitup Industries Corp. [IA][Direct] -
Transfer molding molds and tooling for electronics, semiconductors, IC, rectifiers, LED and diodes packaging.
- HGM, Inc. [IA][Direct] -
Marking and demarking of semiconductor packages.
- InterChip Systems, Inc. [IA][Direct] -
Supplier of MCM and advanced packaging solutions, providing design and prototype engineering services to the electronic industry.
- Intetec Southwest LLC [IA][Direct] -
Microelectronic packaging materials. Products and services include ceramic substrates, ceramic LTCC and high dielectric tapes, custom tape casting & more.
- Johnson Matthey Electronics [IA][Direct] -
A worldwide supplier of materials for the manufacture of integrated circuits, infrared detectors and other materials used in assembly operations.
- Litton/Airtron - Electronic Materials Group [IA][Direct] -
Supplier of semi-insulating GaAs substrates for use in the electronics and defense industries.
- Nanofilm [IA][Direct] -
Producer of photoplate blanks that are used in the process of creating silicon chips.
- NChip [IA][Direct] -
Provides advanced mirco-electronic packaging design and manufacturing solutions such as multichip modules, chip-on-board assemblies, integrated passive components and more.
- Nepenthe Distribution, Inc [IA][Direct] -
Manufacturer and distributor of test burn-in sockets, receptacles, trays, bags, semiconductor packages, and handling hardware supporting back end of semiconductor industry.
- Nitto Denko America, Inc. [IA][Direct]
- Olin Aegis [IA][Direct] -
Produces hermetic metal packages.
- Semicon Systems [IA][Direct] -
Supplies packaging solutions for semiconductor manufacturers. Products include containers, cushions, separators, PGA/DIPS/QFP, and strip packs.
- Sil-Supply Co. [IA][Direct] -
Supply silicon wafers and ingot.
- Surface Mount Taping Corportation [IA][Direct] -
Offers packaging semiconductor and electronic components technology. Semiconductor industry news.
- TDK Corporation of America [IA][Direct] -
Development, manufacture and application of materials used to make electronic components. In addition to ferrite, the company produces dielectric, piezoelectric, semiconductor, metallic and organic materials, among others.
- Tong Hsing Electronic Industries, Ltd. [IA][Direct] -
Manufacturing of microelectronic packaging, including MCM, thick film print and fire substrates, power modules, and PCB assemblies.
- Unisil Corporation [IA][Direct] -
Provider of silicon materials for the semiconductor industry. Products include polished cz and fz wafers and monocrystalline ingot.
- Williams Advanced Materials [IA][Direct] -
Supplier of materials to the hybrid, semiconductor and media industries.
|
